• Your shopping cart is empty!

  • IPC TR-486

IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Association Connecting Electronics Industries , 07/01/2001

Publisher: IPC

File Format: PDF

$71.00$142.00


Standard By:Association Connecting Electronics Industries , 07/01/2001
Published:07/01/2001
Pages:56
File Size:1 file , 760 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.

More IPC Standards PDF

ISA TR18.2.3

ISA TR18.2.3

$21.00 $42.00

ISA TR84.00.04 PART 1

ISA TR84.00.04 PART 1

$90.00 $180.00

ISA 75.10.03

ISA 75.10.03

$58.00 $116.00

ISA 75.10.03

ISA 75.10.03

$29.00 $58.00